Start Date: 10/11/2022 12:00 AM EDT
End Date: 10/12/2022 12:00 AM EDT
Washington, DC United States
IPC Advanced Packaging Symposium
The electronics industry is in the early stages of a new era, with unprecedented change already in motion. In this era of ‘Heterogeneous Integration’ led by massive changes in semiconductor and advanced packaging sectors, the days of following Moore’s Law are over! Chiplet-based design architectures incorporating heterogeneous integration packaging methods will enable next-generation electronic systems and applications. These fundamental changes in the semiconductor sector have significant impact throughout the rest of the electronics supply chain. As lines blur between IC-Substrate and HDI printed circuit board technologies and capabilities, the lines between OSAT and EMS manufactures also blur. Please join us for this important symposium focused on IC-Substrates and OSAT manufacturing.
This symposium has been designed for executives, government, and industry leaders to meet in-person and share insights. The discussion will move past the hype to identify key business and technology issues with near- and longer-term solutions. Focused on opportunities and challenges for next-generation advanced packaging production, the top-down agenda will cover public policy updates, commercial and defense electronics technology drivers, current business environment for IC-Substrates and component assembly & test manufacturing.
IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem