This workshop will be bringing Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly providers together to discuss their efforts to onshore advanced packaging.  The mission of this workshop is to engage our workforce community to identify the newly created Advanced Packaging programs which addresses US Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain.  Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III/Printed Circuit Board Executive Agent), DARPA and SRC will be briefing on their advanced packaging programs.

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