The 56th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society (IMAPS). This year’s program features sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level / Panel Level (Advanced RDL); High Performance / High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technology).