PCB Market Catalyst Overview
The U.S. lacks domestic manufacturing capabilities for Ultra-high Density Interconnect (UHDI) Printed Circuit Boards (PCBs), which are the foundation of most modern electronics systems. Domestic manufacturers have not invested in the newer technology due to the lack of demand. Defense manufacturers will not change designs to take advantage of these newer features until they are sure the demand can be sourced domestically in the proper quality and volume. Commercial demand, including elements of our national security infrastructure like energy, banking, and transportation, is filled by foreign sources.
This capability gap represents a significant risk to U.S. economic security and especially to national security, particularly since adversaries have unfettered access to advanced UHDI technology. The PCB Market Catalyst program, funded by the Department of Defense (DoD) Manufacturing Capability Expansion and Investment Prioritization (MCEIP) Directorate, is designed to identify the challenges and develop a solution that can resolve this situation in the fastest and most cost-effective means possible.
To help ensure this is an industry-supported effort, USPAE conducted research with more than 100 stakeholders to gather insights and provide feedback during the research process. The team visited 14 countries and 22 technology suppliers, conducted qualitative interviews and launched an industry-wide quantitative survey. This extensive research formed the basis for the recommended solution.
The solution must facilitate PCB manufacturers quickly adopting the same proven manufacturing technologies used by Asian counterparts for many years. The fastest and most economical solution is to create a Public-Private Partnership (PPP) that could leverage proven production technologies to bridge the gap while catalyzing demand sufficiently to justify private investment.
This PPP would provide UHDI PCB manufacturing services as a subcontractor to existing domestic PCB manufacturers. That allows the PCB manufacturers to offer new products to their customers while learning about UHDI PCB manufacturing. On a parallel path, the PPP would work to catalyze demand, not only shifting commercial demand to U.S. manufacturers but also reducing adoption barriers like UHDI standards and acceptance criteria.
Once demand is flowing and domestic PCB manufacturers can justify investing in UHDI technology, the PPP would transition technology info and know-how to the U.S. industry, resulting in faster industry-wide adoption than would occur with a few spot investments by the government. Throughout this process, the PPP is helping grow the workforce by upskilling existing workers and training new designers, engineers, operators and technicians.
A final report and comprehensive business plan have been submitted to the DoD.
